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阿普奇 E7L-Q170 是E7L系列无风扇扩展型嵌入式工控机中的企业级旗舰——搭载Intel Q170芯片组,在H81的传奇机箱(268×194mm全铝合金无风扇)中实现NVMe存储、RAID、多PCIe扩展槽和全USB3.0等一系列企业级特性。是E7L三兄弟(H81/H610/Q170)中扩展能力和企业特性最强的型号。
核心平台:Intel 6/7/8/9代Core桌面处理器(35W TDP, LGA1151可更换),Q170企业级芯片组(支持vPro远程管理和长供货周期)。2×DDR4 SO-DIMM 2133MHz双通道(64GB)。6/7代CPU可选Windows 7。
存储打破嵌入式传统——M.2 Key-M支持PCIe Gen3 x4 NVMe(约3.5GB/s读速)+ SATA3.0自适应——是E7L全系列中唯一支持NVMe的型号。2×SATA3.0双盘位(含快拆2.5寸)+ RAID 0/1硬件支持——系统盘NVMe超快+数据盘RAID1镜像保护。
E7L-Q170提供三个机箱版本:
• E7L(67.7mm):基础嵌入式
• E7DL(118.5mm):增加PCIe——3种配置可选(带x4+带PCI+双PCI)
• **E7QL(159.5mm)**:旗舰扩展版——2×PCIe x16(x8/x8)+2×PCI 双路并行 或 PCIe x16(x16)+PCIe x4(x4) 单路全速
E7QL的双x8并存架构允许同时安装两张PCIe卡(如AI加速卡+采集卡),这是E7系列中扩展能力最强的配置。
扩展系统企业级:MXM(4LAN/4PoE/6COM/16GPIO)+ Mini PCIe(PCIe x1+USB2.0, SIM1)+ M.2 Key-B(PCIe x1+USB3.0, SIM2, 3052)——三扩展+双Nano SIM。M.2 Key-B原生4G/5G模块支持。
I/O:6×全USB3.0(前置, 无USB2.0降速端口)+ 2×USB2.0(内置)+3×USB2.0(TF_Panel)。6路COM。VGA+DVI-D+DP 4K@60Hz+LVDS/eDP 4屏。
工业可靠性:-20~60℃,30G冲击,3Grms振动,DC 9-36V宽压,CCC+CE/FCC+RoHS认证。
Q170+NVMe+RAID+E7QL双x8+全USB3.0+2SIM——E7L-Q170是E7L三兄弟中企业级特性最完整的型号。
|
Model |
E7L |
E7DL |
E7QL |
|
|
CPU |
CPU | Intel® 6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU | ||
| TDP | 35W | |||
| Socket | LGA1151 | |||
|
Chipset |
Chipset | Q170 | ||
|
BIOS |
BIOS | AMI UEFI BIOS (Support Watchdog Timer) | ||
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2133MHz | ||
| Max Capacity | 64GB, Single Max. 32GB | |||
|
Graphics |
Controller | Intel® HD Graphics | ||
|
Ethernet |
Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
||
|
Storage |
SATA | 1 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm) 1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional) Support RAID 0, 1 |
||
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | |||
|
Expansin Slots |
PCIe/PCI | N/A | ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) ②: 1 * PCIe x16 + 1 * PCI ③: 2 * PCI PS: ①、②、③ One out of three, Expansion card length ≤ 185mm, TDP ≤ 130W |
①: 2 * PCIe x16 (x8/x8) + 2 * PCI②:1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)
PS: ①、② One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
| MXM/aDoor | 1 * APQ MXM (Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |||
| Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, with 1 * SIM Card) | |||
| M.2 | 1 * M.2 Key-B (PCIe x1 Gen 2 + USB3.0, with 1 * SIM Card, 3052) | |||
|
Front I/O |
Ethernet | 2 * RJ45 | ||
| USB | 6 * USB3.0 (Type-A, 5Gbps) | |||
| Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz 1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
|||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |||
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) |
|||
| Button | 1 * Power Button + Power LED 1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
|||
|
Rear I/O |
Antenna | 4 * Antenna hole | ||
| SIM | 2 * Nano SIM card slots | |||
|
Internal I/O |
USB | 2 * USB2.0 (wafer) | ||
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | |||
| TFront Panel | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | |||
| Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | |||
| Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |||
| Serial | 2 * RS232 (COM5/6, wafer) | |||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | |||
| LPC | 1 * LPC (wafer) | |||
| SATA | 2 * SATA 7P Connector | |||
| SATA Power | 2 * SATA Power (wafer) | |||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (wafer) |
|||
|
Power Supply |
Type | DC, AT/ATX | ||
| Power Input Voltage | 9 ~ 36VDC, P≤240W | |||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | |||
| RTC Battery | CR2032 Coin Cell | |||
|
OS Support |
Windows | 6/7th Core™: Windows 7/10/11 8/9th Core™: Windows 10/11 |
||
| Linux | Linux | |||
|
Watchdog |
Output | System Reset | ||
| Interval | Programmable via Software from 1 to 255 sec | |||
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | ||
| Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | 268mm(L) * 194.2mm(W) * 159.5mm(H) | |
| Weight | Net: 4.5 kg Total: 6 kg (Include packaging) |
Net: 4.7kg Total: 6.2 kg (Include packaging) |
Net: 4.8 kg Total: 6.3 kg (Include packaging) |
|
| Mounting | VESA, Wall mounted, Desktop | |||
|
Environment |
Heat Dissipation System | Fanless Passive Cooling | ||
| Operating Temperature | -20~60℃ (Industrial SSD) | |||
| Storage Temperature | -40~80℃ (Industrial SSD) | |||
| Relative Humidity | 10 to 90% RH (non-condensing) | |||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |||
| Certification | CCC, CE/FCC, RoHS | |||

