
远程管理
状态监控
远程运维
安全控制
联系我们
扫码即可添加微信,售前客服为您提供咨询服务
阿普奇 E7L-H81 是阿普奇E7系列无风扇扩展型嵌入式工控机中的桌面CPU平台旗舰。E7系列以在完全无风扇被动散热条件下支持桌面级处理器(LGA可更换)、标准PCIe/PCI扩展卡和-20~60℃宽温而著称,是嵌入式工控机品类中综合扩展能力和显示能力最强的顶级型号。
核心平台:Intel 4/5代酷睿/Pentium/Celeron桌面处理器(35W TDP, LGA1150标准接口——用户可自行更换CPU),搭配Intel H81芯片组。2×DDR3 SO-DIMM双通道1600MHz(最大16GB)。革命性的是——35W桌面CPU在全铝合金机箱中实现完全无风扇被动散热,不需要任何风扇辅助。
E7L系列提供两个机箱版本:
• E7L(基础版, 67.7mm厚度):标准嵌入式机箱
• E7DL(扩展版, 118.5mm厚度):增加PCIe/PCI扩展槽——1×PCIe x16(x16通道)或2×PCI,扩展卡长度≤185mm,TDP≤130W。是阿普奇唯一在无风扇嵌入式机箱中提供标准PCIe/PCI扩展的型号。
显示系统在嵌入式品类中规格最高——4路独立显示:DP(4096×2160@60Hz)+ DVI-D(1920×1200@60Hz)+ VGA(1920×1200@60Hz)+ LVDS(1920×1200@60Hz, wafer内置)——四屏联动。这是目前在售嵌入式产品中显示输出数量最多的型号。
模块化扩展:MXM接口支持4×LAN/4×PoE/6×COM/16×GPIO扩展卡 + aDoor扩展插槽。双模块方案联合提供灵活I/O定制能力。
存储三盘位:1×SATA3.0快拆2.5寸盘位(≤7mm, 免工具快速拆卸)+ 1×SATA2.0内置2.5寸盘位(≤9mm, 选配)+ M.2 Key-M(SATA3.0, 2280)。快拆盘位支持现场无工具更换硬盘。
控制与通信:6路COM——COM1/2为RS232/422/485全定义(DB9/M, BIOS切换)、COM3/4为RS232(DB9/M)、COM5/6为RS232(wafer)。i210-AT + i218-LM/V双Intel千兆。16路DIO(8DI+8DO)。Mini PCIe + Nano SIM(与MXM共享PCIe信号, 可选)。4个天线孔。2W扬声器。
工业可靠性与环境:工作温度-20~60℃(工业SSD),30G冲击,3Grms振动,DC 9~36V超宽压(P≤240W)。AT/ATX切换。CCC/CE/FCC/RoHS认证。
LGA桌面CPU+PCIe扩展+四屏显示+快拆硬盘+MXM+aDoor+-20~60℃+9-36V——E7L-H81是阿普奇无风扇嵌入式产品线中综合能力最强的旗舰。
|
Model |
E7L |
E7DL |
|
|
CPU |
CPU | Intel® 4/5th Generation Core / Pentium/ Celeron Desktop CPU | |
|
|
TDP | 35W | |
|
|
Socket | LGA1150 | |
|
Chipset |
Chipset | Intel® H81 | |
|
BIOS |
BIOS | AMI UEFI BIOS (Support Watchdog Timer) | |
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR3 up to 1600MHz | |
|
|
Max Capacity | 16GB, Single Max. 8GB | |
|
Graphics |
Controller | Intel® HD Graphics | |
|
Ethernet |
Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps)
1 * Intel i218-LM/V GbE LAN Chip (10/100/1000 Mbps) |
|
|
Storage |
SATA | 1 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm) 1 * SATA2.0, Internal 2.5" hard disk bays (T≤9mm, Optional) |
|
|
|
M.2 | 1 * M.2 Key-M (SATA3.0, 2280) | |
|
Expansin Slots |
PCIe/PCI | N/A | ①: 1 * PCIe x16 (x16)
②: 2 * PCI PS: ①、②One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
|
|
MXM/aDoor | 1 * APQ MXM (Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card)
1 * aDoor Expansion Slot |
|
|
|
Mini PCIe | 1 * Mini PCIe (PCIe2.0 x1 (Share PCIe signal with MXM, optional) + USB 2.0, with 1*Nano SIM Card) | |
|
Front I/O |
Ethernet | 2 * RJ45 | |
|
|
USB | 2 * USB3.0 (Type-A, 5Gbps)
4 * USB2.0 (Type-A) |
|
|
|
Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz
1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
|
|
|
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
|
|
Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch)
2 * RS232 (COM3/4, DB9/M) |
|
|
|
Button | 1 * Power Button + Power LED
1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
|
|
Rear I/O |
Antenna | 4 * Antenna hole | |
|
|
SIM | 1 * Nano SIM card slot (SIM1) | |
|
Internal I/O |
USB | 2 * USB2.0 (wafer) | |
|
|
LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | |
|
|
TFront Panel | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | |
|
|
Front Panel | 1 * Front Panel (PWR + RST + LED, wafer) | |
|
|
Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |
|
|
Serial | 2 * RS232 (COM5/6, wafer) | |
|
|
GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | |
|
|
LPC | 1 * LPC (wafer) | |
|
|
SATA | 2 * SATA 7P Connector | |
|
|
SATA Power | 2 * SATA Power (SATA_PWR1/2, wafer) | |
|
|
FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (wafer) |
|
|
Power Supply |
Type | DC, AT/ATX | |
|
|
Power Input Voltage | 9 ~ 36VDC, P≤240W | |
|
|
Connector | 1 * 4Pin Connector, P=5.00/5.08 | |
|
|
RTC Battery | CR2032 Coin Cell | |
|
OS Support |
Windows | Windows 7/10/11 | |
|
|
Linux | Linux | |
|
Watchdog |
Output | System Reset | |
|
|
Interval | Programmable via Software from 1 to 255 sec | |
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | |
|
|
Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) |
|
|
Weight | Net: 4.5 kg
Total: 6 kg (Include packaging) |
Net: 4.7kg
Total: 6.2 kg (Include packaging) |
|
|
Mounting | VESA, Wall mounted, Desktop | |
|
Environment |
Heat Dissipation System | Fanless Passive Cooling | |
| Operating Temperature | -20~60℃ (Industrial SSD) | ||
| Storage Temperature | -40~80℃ (Industrial SSD) | ||
| Relative Humidity | 10 to 90% RH (non-condensing) | ||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | ||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | ||
| Certification | CCC, CE/FCC, RoHS | ||
