阿普奇 E6-11th-U | 模块扩展型 紧凑型嵌入式工控机
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阿普奇 E6-11th-U | 模块扩展型 紧凑型嵌入式工控机
产品描述
阿普奇 E6-11th-U 是阿普奇E6系列高性能嵌入式工控机中的11代酷睿-U平台型号。E6系列定位为E系列的旗舰产品线——在比C6更大的机箱（249×151.8×56mm）中实现aDoor高速模块化总线、热插拔硬盘位和-20~60℃宽温无风扇散热，是以模块化扩展和工业可靠性为核心的高端嵌入式IPC。
核心平台：Intel 11代酷睿i3/i5/i7移动-U处理器——i5/i7型号集成Iris Xe Graphics（96EU），可通过OpenVINO运行轻量AI推理。2×DDR4 SO-DIMM双通道3200MHz（64GB）——在嵌入式IPC中提供服务器级的内存容量。
网络：i210-AT工业千兆 + i219管理千兆。
aDoor模块化总线是E6的核心创新——与E5/C5系列的简单叩门接口不同，E6的aDoor总线具备PCIe x2 + LPC + 16路GPIO的高带宽信号通道。这意味着aDoor模块不仅是低速I/O扩展（GPIO/COM），更可以承载高速设备（如额外以太网控制器、CAN总线模块等）。
存储方案在嵌入式IPC中属高配：M.2 Key-M（PCIe x4 Gen3 + SATA3.0自适应, 2280）+ SATA3.0（内部7Pin + 电源）+ 前置2.5寸热插拔硬盘盘位（兼容aDoor模块位置）——三盘位存储+模块化扩展二合一。
I/O：前置4路USB（2×USB3.2 Gen2x1 10Gbps + 2×USB3.2 Gen1x1 5Gbps）+ 4路USB2.0（wafer内置）。6路COM——COM1/2为RS232/485 DB9/M（前置, BIOS控制），COM3-6为wafer内置。DP（4096×2304@60Hz）+ HDMI（3840×2160@24Hz）+ LVDS三显。
工业可靠性：-20~60℃工作温度（-20℃极限低温，覆盖冷库和户外冬季），30G冲击，3Grms振动，无风扇被动散热，AT/ATX切换，OS Recovery系统还原按键，2W扬声器。
aDoor总线+Iris Xe+64GB+三盘位+热插拔+-20℃——E6-11th-U是嵌入式工控机中扩展能力和环境适应力均达到高水平的高端平台。
|
Model |
E6 |
|
|
Processor System |
CPU | Intel® 11th Generation Core™ i3/i5/i7 Mobile -U CPU |
| Chipset | SOC | |
| BIOS | AMI EFI BIOS | |
|
Memory |
Socket | 2 * DDR4-3200 MHz SO-DIMM Slot |
| Max Capacity | 64GB, Single Max. 32GB | |
|
Graphics |
Controller | Intel® UHD Graphics/Intel® Iris® Xe Graphics (dependent on CPU type) |
|
Ethernet |
Controller | 1 * Intel® i210-AT (10/100/1000 Mbps, RJ45) 1 * Intel® i219 (10/100/1000 Mbps, RJ45) |
|
Storage |
SATA | 1 * SATA3.0 Connector |
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, Auto Detect, 2280) | |
|
Expansion Slots |
aDoor Bus | 1 * aDoor Bus (16*GPIO + PCIe x2 + 1*LPC) |
| Mini PCIe | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * SIM Card) 1 * Mini PCIe Slot (PCIe x1+USB 2.0) |
|
|
Front I/O |
USB | 2 * USB3.2 Gen2x1 (Type-A) 2 * USB3.2 Gen1x1 (Type-A) |
| Ethernet | 2 * RJ45 | |
| Display | 1 * DP: up to 4096x2304 @ 60Hz 1 * HDMI (Type-A): up to 3840x2160 @ 24Hz |
|
| Serial | 2 * RS232/485 (COM1/2, DB9/M, BIOS control) | |
| Switch | 1 * AT/ATX Mode Switch (Enable/Disable automatically power on) | |
| Button | 1 * Reset (hold down 0.2 to 1s to restart, 3s to clear CMOS) 1 * OS Rec (system recovery) |
|
| Power | 1 * Power Input Connector (12~28V) | |
|
Rear I/O |
SIM | 1 * Nano SIM Card Slot |
| Button | 1 * Power Button + Power LED 1 * PS_ON |
|
| Audio | 1 * 3.5mm Audio Jack (Line-Out + MIC, CTIA) | |
|
Internal I/O |
Front Panel | 1 * Front Panel (wafer, 3x2Pin, PHD2.0) |
| FAN | 1 * CPU FAN (wafer) 1 * SYS FAN (wafer) |
|
| Serial | 1 * COM3/4 (wafer) 1 * COM5/6 (wafer) |
|
| USB | 4 * USB2.0 (wafer) | |
| Display | 1 * LVDS (wafer) | |
| LPC | 1 * LPC (wafer) | |
| Storage | 1 * SATA3.0 7Pin Connector 1 * SATA Power |
|
| Audio | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |
| GPIO | 1 * 16bits DIO (8xDI and 8xDO, wafer) | |
|
Power Supply |
Type | DC |
| Power Input Voltage | 12~28VDC | |
| Connector | 1 * 2Pin Power Input Connector (P=5.08mm) | |
| RTC Battery | CR2032 Coin Cell | |
|
OS Support |
Windows | Windows 10 |
| Linux | Linux | |
|
Watchdog |
Output | System Reset |
| Interval | Programmable 1 ~ 255 sec | |
|
Mechanical |
Enclosure Material | Radiator: Aluminum, Box: SGCC |
| Dimensions | 249mm(L) * 152mm(W) * 55.5mm(H) | |
| Weight | Net: 1.8KgTotal: 2.8Kg | |
| Mounting | VESA, Wallmount, Desk mounting | |
|
Environment |
Heat Dissipation System | Passive heat dissipation |
| Operating Temperature | -20~60℃ | |
| Storage Temperature | -40~80℃ | |
| Relative Humidity | 5 to 95% RH (non-condensing) | |
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |
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嵌入式工控机/BOX E6系列11th-U平台
