TAC-3000 机器人控制器
远程管理
状态监控
远程运维
安全控制
联系我们
扫码即可添加微信，售前客服为您提供咨询服务
产品描述
阿普奇无人叉车控制器TAC-3000是一款专为无人叉应用而设计的高性能AI控制器。TAC-3000采用NVIDIA Jetson TMS O-DIMM连接器核心板，支持高性能的AI计算，最高可达100TOPS算力。能够满足机器人应用中对强大计算能力的需求的同时保证高能效和低功耗。默认板载3个千兆网络接口和4个USB3.0接口，提供高速稳定的网络连接和数据传输能力。支持多种扩展功能，包括可选的16位DIO、2个RS232/RS485可配置COM接口等，灵活配置外部设备连接。同时支持5G/4G/WiFi功能扩展，提供稳定的无线通信连接，确保机器人在不同环境下都能够保持通信畅通。支持DC 12~28V宽压输入，适应不同的电源环境。采用无风扇超紧凑设计，全金属高强度机身，能够适应各种恶劣的环境条件，使得控制器能够安装在各种狭小的空间内。同时，TAC-3000还支持桌面式和DIN安装方式，可根据实际应用需求进行安装部署。
综上所述，阿普奇无人叉车控制器TAC-3000凭借其强大的AI算力、高速网络连接、丰富的I/O接口和卓越的扩展性能，为无人叉车应用提供了稳定、高效的支持。
| Model | TAC-3000 | ||||
| Processor System | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
| AI Performance | 472 GFLOPS | 1.33 TFLOPS | 21 TOPS | ||
| GPU | 128-core NVIDIA Maxwell™ architecture GPU | 256-core NVIDIA Pascal™ architecture GPU | 384-core NVIDIA Volta™ architecture GPU with 48 Tensor Cores | ||
| GPU Max Frequency | 921MHz | 1.3 GHz | 1100 MHz | ||
| CPU | Quad-core ARM® Cortex®-A57 MPCore processor | Dual-core NVIDIA DenverTM 2 64-bit CPU
and quad-core Arm® Cortex®-A57 MPCore processor |
6-core NVIDIA Carmel Arm® v8.2 64-bit CPU
6MB L2 + 4MB L3 |
||
| CPU Max Frequency | 1.43GHz | Denver 2: 2 GHz
Cortex-A57: 2 GHz |
1.9 GHz | ||
| Memory | 4GB 64-bit LPDDR4 25.6GB/s | 4GB 128-bit LPDDR4 51.2GB/s | 8GB 128-bit LPDDR4x 59.7GB/s | 16GB 128-bit LPDDR4x 59.7GB/s | |
| TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
| Processor System | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
| AI Performance | 20 TOPS | 40 TOPS | 70 TOPS | 100 TOPS | |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU
with 32 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU
with 32 Tensor Cores |
||
| GPU Max Frequency | 625 MHz | 765 MHz | 918 MHz | ||
| CPU | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3 |
6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core Arm® Cortex® A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 | ||
| CPU Max Frequency | 1.5 GHz | 2 GHz | |||
| Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
| TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
| Ethernet | Controller | 1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps
2 * Intel® I210-AT, 10/100/1000 Mbps |
|||
| Storage | eMMC | 16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
| M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
| TF Slot | 1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
| Expansion
Slots |
Mini PCIe | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
| M.2 | 1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
| Front I/O | Ethernet | 2 * RJ45 | |||
| USB | 4 * USB3.0 (Type-A) | ||||
| Display | 1 * HDMI: Resolution up to 4K @ 60Hz | ||||
| Button | 1 * Power Button + Power LED 1 * System Reset Button |
||||
| Side I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
| Button | 1 * Recovery Button | ||||
| Antenna | 4 * Antenna hole | ||||
| SIM | 2 * Nano SIM | ||||
| Internal I/O | Serial | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)
1 * RS232/TTL (COM3, wafer, Jumper Switch) |
|||
| PWRBT | 1 * Power Button (wafer) | ||||
| PWRLED | 1 * Power LED (wafer) | ||||
| Audio | 1 * Audio (Line-Out + MIC, wafer)
1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) |
||||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
| CAN Bus | 1 * CAN (wafer) | ||||
| FAN | 1 * CPU FAN (wafer) | ||||
| Power Supply | Type | DC, AT | |||
| Power Input Voltage | 12~28V DC | ||||
| Connector | Terminal block, 2Pin, P=5.00/5.08 | ||||
| RTC Battery | CR2032 Coin Cell | ||||
| OS Support | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3
Orin Nano/Orin NX: JetPack 5.3.1 |
|||
| Mechanical | Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | |||
| Dimensions | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
| Mounting | Desktop、DIN-rail | ||||
| Environment | Heat Dissipation System | Fan less design | |||
| Operating Temperature | -20~60℃ with 0.7 m/s airflow | ||||
| Storage Temperature | -40~80℃ | ||||
| Relative Humidity | 10 to 95% (non-condensing) | ||||
| Vibration | 3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
| Shock | 10G, half sine, 11ms (IEC 60068-2-27) | ||||
-
TAC-3000 机器人控制器
