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阿普奇车路协同控制器E7Pro系列Q670平台是一款更适用于车路协同行业的嵌入式工控机,搭载了Intel 酷睿6/7/8/9/12/13代CPU,能够轻松应对各种数据处理挑战;提供2个SO-DIMM笔记本内存插槽,DDR4双通道支持,高达3200Mhz的内存频率,单条容量最大支持32GB, 容量最大支持64GB。采用创新的抽拉式硬盘设计,不仅插拔更加顺畅,而且有效提高了数据传输的稳定性和可靠性。支持软RAID 0/1/5数据保护功能,保护您的核心数据。配备多元化扩展卡槽配置,包括2PCIe 8X+2PCI、1PCIe 16X+1PCIe 4X以及1PCIe 16X+3PCI等。完美支持TDP≤450W、长度≤320mm、4槽位以内的显卡,轻松应对高功耗显卡带来的挑战。配备全新的无风扇散热器,支持最大TDP 65W CPU。全新的PCIE显卡固定支架,大大提升了显卡的稳定性和兼容性。结构整体优化后,成本更低、组装更简单,机箱风扇快拆设计,使得维护和清洁变得轻而易举。
总的来说,阿普奇嵌入式工控机新品E7Pro在各个细节上都展现出了卓越的性能和稳定性,在设计上充分考虑到了用户的需求和体验,是我们倾力打造的一款真正适用于复杂和高负荷工业场景的嵌入式工控机。
Model |
E7 Pro |
|
CPU |
CPU | Intel® 12th /13th Gen Core/Pentium/Celeron desktop processor |
TDP | 65W | |
Socket | LGA1700 | |
Chipset | Q670 | |
BIOS | AMI 256 Mbit SPI | |
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 3200MHz |
Max Capacity | 64GB, Single Max. 32GB | |
Graphics |
Controller | Intel® UHD Graphics |
Ethernet |
Controller | 1 * Intel i219-LM 1GbE LAN Chip (LAN1, 10/100/1000 Mbps, RJ45) 1 * Intel i225-V 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps, RJ45) |
Storage |
SATA | 3 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm), Support RAID 0, 1, 5 |
M.2 | 1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
Expansion Slots |
PCIe Slot | ①: 2 * PCIe x16 (x8/x8) + 2 * PCI
②: 2 * PCIe x16 (x8/x8) + 1 * PCIe x4 (x4) PS: ①、② One out of two, Expansion card length ≤ 320mm, TDP ≤ 450W |
aDoor | 1 * aDoor Bus (Optional 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |
Mini PCIe | 2 * Mini PCIe (PCIe x1 Gen 3 + USB 2.0, with 1 * SIM Card) | |
M.2 | 1 * M.2 Key-E (PCIe x1 Gen 3 + USB 2.0, 2230) | |
Front I/O |
Ethernet | 2 * RJ45 |
USB | 2 * USB3.2 Gen 2x1 (Type-A, 10Gbps) 6 * USB3.2 Gen 1x1 (Type-A, 5Gbps) |
|
Display | 1 * HDMI1.4b: max resolution up to 4096*2160 @ 30Hz 1 * DP1.4a: max resolution up to 4096*2160 @ 60Hz |
|
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
Serial | 2 * RS232/485/422 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M, Full Lanes) |
|
Button | 1 * Power Button/LED 1 * AT/ATX Button 1 * OS Recover Button 1 * System Reset Button |
|
Rear I/O |
Antenna | 6 * Antenna hole |
Internal I/O |
USB | 6 * USB2.0 (wafer, Internal I/O) |
LCD | 1 * LVDS (wafer): LVDS Resolution up to 1920*1200 @ 60Hz | |
Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | |
Audio | 1 * Audio (Header) 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) |
|
Serial | 2 * RS232 (COM5/6, wafer) | |
GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | |
LPC | 1 * LPC (wafer) | |
SATA | 3 * SATA 7P Connector, up to 600MB/s | |
SATA Power | 3 * SATA Power (wafer) | |
SIM | 2 * Nano SIM | |
FAN | 2 * SYS FAN (4x1Pin, KF2510-4A) | |
Power Supply |
Type | DC, AT/ATX |
Power Input Voltage | 18~60VDC, P=600/800/1000W (Default 800W) | |
Connector | 1 * 3Pin Connector, P=10.16 | |
RTC Battery | CR2032 Coin Cell | |
OS Support |
Windows | Windows 10/11 |
Linux | Linux | |
Watchdog |
Output | System Reset |
Interval | Programmable 1 ~ 255 sec | |
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC |
Dimensions | 363mm(L) * 270mm(W) * 169mm(H) | |
Weight | Net: 10.48 kg
Total: 11.38 kg (Include packaging) |
|
Mounting | Wall mounted, Desktop | |
Environment |
Heat Dissipation System | Fanless Passive Cooling (CPU)
2 * 9cm PWM FAN (Internal) |
Operating Temperature | -20~60℃ (Industrial SSD) | |
Storage Temperature | -40~80℃ (Industrial SSD) | |
Relative Humidity | 10 to 90% RH (non-condensing) | |
Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) |