产品

E7L系列Q170平台嵌入式工控机/BOX

E7L系列Q170平台嵌入式工控机/BOX

特点:

  • 支持Intel® 6~9th Gen Core / Pentium/ Celeron Desktop CPU, TDP 35W, LGA1151
  • 搭配Intel® Q170芯片组
  • 2个Intel千兆网络接口
  • 2个DDR4 SO-DIMM插槽,最大支持 64G
  • 4个DB9串口(COM1/2支持RS232/RS422/RS485)
  • 4路显示输出VGA,DVI-D,DP和内部LVDS/eDP,最高支持4K@60Hz分辨率
  • 4G/5G/WIFI/BT无线功能扩展支持
  • MXM、aDoor模块扩展支持
  • 可选PCIe/PCI标准扩展槽位支持
  • 9~36V直流供电(可选12V)
  • 无风扇被动式散热

  • 远程管理

    远程管理

  • 状态监控

    状态监控

  • 远程运维

    远程运维

  • 安全控制

    安全控制

产品描述

阿普奇嵌入式工控机E7L系列Q170平台是一款专为工业自动化和边缘计算设计的强大设备。它支持最新的Intel处理器,包括6至9代Core、Pentium和Celeron系列,提供高效性能和稳定运行。采用Intel Q170芯片组,提供稳健的硬件平台和丰富的扩展功能。该平台配备2个千兆网络接口,确保高速稳定的网络连接。内存方面,E7L系列支持最大64GB DDR4内存,满足大量数据和复杂计算需求。此外,它还提供4个DB9串口,支持RS232/RS422/RS485协议,便于与外部设备通信。在显示方面,该平台拥有4路显示输出,支持VGA、DVI-D、DP和内部LVDS/eDP,最高支持4K@60Hz分辨率。无线功能方面,E7L系列支持4G/5G/WIFI/BT扩展,满足各种无线通信需求。此外,它还提供MXM和aDoor模块扩展支持,可根据应用需求进行定制配置。供电方面,支持9~36V直流供电(可选12V),确保稳定运行。散热设计采用无风扇被动式散热,提高系统可靠性。

总之,阿普奇E7L-Q170嵌入式工控机为工业自动化和边缘计算提供强大支持,满足各种复杂应用场景的需求。

产品介绍

工程图纸

下载文件

Model

E7L

E7DL

E7QL

CPU

CPU Intel® 6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU
TDP 35W
Socket LGA1151

Chipset

Chipset Q170

BIOS

BIOS AMI UEFI BIOS (Support Watchdog Timer)

Memory

Socket 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2133MHz
Max Capacity 64GB, Single Max. 32GB

Graphics

Controller Intel® HD Graphics

Ethernet

Controller 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps)
1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps)

Storage

SATA 1 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm)
1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional)
Support RAID 0, 1
M.2 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280)

Expansin Slots

PCIe/PCI N/A ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)
②: 1 * PCIe x16 + 1 * PCI
③: 2 * PCI
PS: ①③ One out of three, Expansion card length ≤ 185mm, TDP ≤ 130W
①: 2 * PCIe x16 (x8/x8) + 2 * PCI②:1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

PS: ①② One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W

MXM/aDoor 1 * APQ MXM  (Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card)
Mini PCIe 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, with 1 * SIM Card)
M.2 1 * M.2 Key-B (PCIe x1 Gen 2 + USB3.0, with 1 * SIM Card, 3052)

Front I/O

Ethernet 2 * RJ45
USB 6 * USB3.0 (Type-A, 5Gbps)
Display 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz
1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz
1 * DP: max resolution up to 4096*2160 @ 60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Serial 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch)
2 * RS232 (COM3/4, DB9/M)
Button 1 * Power Button + Power LED
1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS)

Rear I/O

Antenna 4 * Antenna hole
SIM 2 * Nano SIM card slots

Internal I/O

USB 2 * USB2.0 (wafer)
LCD 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz
TFront Panel 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer)
Front Panel 1 * FPanel (PWR + RST + LED, wafer)
Speaker 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer)
Serial 2 * RS232 (COM5/6, wafer)
GPIO 1 * 16 bits DIO (8xDI and 8xDO, wafer)
LPC 1 * LPC (wafer)
SATA 2 * SATA 7P Connector
SATA Power 2 * SATA Power (wafer)
FAN 1 * CPU FAN (wafer)
2 * SYS FAN (wafer)

Power Supply

Type DC, AT/ATX
Power Input Voltage 9 ~ 36VDC, P≤240W
Connector 1 * 4Pin Connector, P=5.00/5.08
RTC Battery CR2032 Coin Cell

OS Support

Windows 6/7th Core™: Windows 7/10/11
8/9th Core™: Windows 10/11
Linux Linux

Watchdog

Output System Reset
Interval Programmable via Software from 1 to 255 sec

Mechanical

Enclosure Material Radiator: Aluminum alloy, Box: SGCC
Dimensions 268mm(L) * 194.2mm(W) * 67.7mm(H) 268mm(L) * 194.2mm(W) * 118.5mm(H) 268mm(L) * 194.2mm(W) * 159.5mm(H)
Weight Net: 4.5 kg
Total: 6 kg (Include packaging)
Net: 4.7kg
Total: 6.2 kg (Include packaging)
Net: 4.8 kg
Total: 6.3 kg (Include packaging)
Mounting VESA, Wall mounted, Desktop

Environment

Heat Dissipation System Fanless Passive Cooling
Operating Temperature -20~60℃ (Industrial SSD)
Storage Temperature -40~80℃ (Industrial SSD)
Relative Humidity 10 to 90% RH (non-condensing)
Vibration During Operation With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
Shock During Operation With SSD: IEC 60068-2-27 (30G, half sine, 11ms)
Certification CCC, CE/FCC, RoHS

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  • 嵌入式工控机/BOX E7L系列Q170平台

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