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阿普奇边缘AI平台TAC-3000是一款更适用于边缘计算领域的嵌入式工控机,具备强大的计算能力和丰富的功能特点。嵌入式工控机TAC-3000采用高性能AI控制器,算力高达100TOPS,可快速处理复杂的AI算法和大量数据,确保边缘计算的效率和准确性。支持NVIDIA Jetson TMS O-DIMM连接器核心板,提供高性能AI计算单元,满足各种边缘计算应用需求。嵌入式工控机TAC-3000还具有丰富的扩展接口,包括3个千兆网络接口、4个USB 3.0接口以及可选的16位DIO和2个RS232/RS485 COM接口,适应各种不同的边缘计算应用需求。支持5G/4G/WiFi功能扩展,具备强大的无线通信能力,实现高速数据交互。同时采用无风扇超紧凑设计,全金属高强度机身,支持桌面式和DIN安装方式,方便部署和使用。提供稳定的DC 12~28V宽压输入,确保在各种工作条件下稳定运行,满足高负载边缘计算场景需求。
总之,阿普奇嵌入式工控机TAC-3000凭借强大的计算能力、丰富的扩展接口、稳定的电源供应、强大的无线通信能力以及灵活的部署方式等特点,满足现代边缘计算应用需求。适用于各种边缘计算场景,推动边缘计算技术的发展和应用。
Model |
TAC-3000 |
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Processor System |
SOM |
Nano |
TX2 NX |
Xavier NX |
Xavier NX 16GB |
AI Performance |
472 GFLOPS |
1.33 TFLOPS |
21 TOPS |
||
GPU |
128-core NVIDIA Maxwell™ architecture GPU |
256-core NVIDIA Pascal™ architecture GPU |
384-core NVIDIA Volta™ architecture GPU with 48 Tensor Cores |
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GPU Max Frequency |
921MHz |
1.3 GHz |
1100 MHz |
||
CPU |
Quad-core ARM® Cortex®-A57 MPCore processor |
Dual-core NVIDIA DenverTM 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor |
6-core NVIDIA Carmel Arm® v8.2 64-bit CPU 6MB L2 + 4MB L3 |
||
CPU Max Frequency |
1.43GHz |
Denver 2: 2 GHz Cortex-A57: 2 GHz |
1.9 GHz |
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Memory |
4GB 64-bit LPDDR4 25.6GB/s |
4GB 128-bit LPDDR4 51.2GB/s |
8GB 128-bit LPDDR4x 59.7GB/s |
16GB 128-bit LPDDR4x 59.7GB/s |
|
TDP |
5W-10W |
7.5W - 15W |
10W - 20W |
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Processor System |
SOM |
Orin Nano 4GB |
Orin Nano 8GB |
Orin NX 8GB |
Orin NX 16GB |
AI Performance |
20 TOPS |
40 TOPS |
70 TOPS |
100 TOPS |
|
GPU |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
||
GPU Max Frequency |
625 MHz |
765 MHz |
918 MHz |
|
|
CPU |
6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
8-core Arm® Cortex® A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
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CPU Max Frequency |
1.5 GHz |
2 GHz |
|||
Memory |
4GB 64-bit LPDDR5 34 GB/s |
8GB 128-bit LPDDR5 68 GB/s |
8GB 128-bit LPDDR5 102.4 GB/s |
16GB 128-bit LPDDR5 102.4 GB/s |
|
TDP |
7W - 10W |
7W - 15W |
10W - 20W |
10W - 25W |
|
Ethernet |
Controller |
1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps2 * Intel® I210-AT, 10/100/1000 Mbps | |||
Storage |
eMMC |
16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
M.2 |
1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
TF Slot |
1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
Expansion Slots |
Mini PCIe |
1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
M.2 |
1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
Front I/O |
Ethernet |
2 * RJ45 | |||
USB |
4 * USB3.0 (Type-A) | ||||
Display |
1 * HDMI: Resolution up to 4K @ 60Hz | ||||
Button |
1 * Power Button + Power LED 1 * System Reset Button |
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Side I/O |
USB |
1 * USB 2.0 (Micro USB, OTG) | |||
Button |
1 * Recovery Button | ||||
Antenna |
4 * Antenna hole | ||||
SIM |
2 * Nano SIM | ||||
Internal I/O |
Serial |
2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
PWRBT |
1 * Power Button (wafer) | ||||
PWRLED |
1 * Power LED (wafer) | ||||
Audio |
1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) | ||||
GPIO |
1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
CAN Bus |
1 * CAN (wafer) | ||||
FAN |
1 * CPU FAN (wafer) | ||||
Power Supply |
Type |
DC, AT | |||
Power Input Voltage |
12~28V DC | ||||
Connector |
Terminal block, 2Pin, P=5.00/5.08 | ||||
RTC Battery |
CR2032 Coin Cell | ||||
OS Support |
Linux |
Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
Mechanical |
Enclosure Material |
Radiator: Aluminum alloy, Box: SGCC | |||
Dimensions |
150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
Mounting |
Desktop、DIN-rail | ||||
Environment |
Heat Dissipation System |
Fan less design | |||
Operating Temperature |
-20~60℃ with 0.7 m/s airflow | ||||
Storage Temperature |
-40~80℃ | ||||
Relative Humidity |
10 to 95% (non-condensing) | ||||
Vibration |
3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
Shock |
10G, half sine, 11ms (IEC 60068-2-27) |