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Model |
TER30J-B3 |
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Core Modules |
Jetson AGX Orin 32GB, 200 TOPS | Jetson AGX Orin 64GB, 275 TOPS | |
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Ethernet |
Controller | 1 * Marvell® AQR113C,10/100/1000/2500/5000/10000 Mbps | |
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1 * Marvell® 88E1512,10/100/1000 Mbps | ||
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2 * Intel® i226-V/LM,10/100/1000/2500 Mbps | ||
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Storage |
M.2 | 1 * M.2 Key-M Slot (NVMe SSD, 2280) | |
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TF | 1 * TF Card Slot | |
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Expansion Slots |
M.2 | 1 * M.2 Key-B Slot (USB 5Gbps + USB 2.0, 3052, with 1 * Nano SIM Card Slot) | |
| 1 * M.2 Key-E Slot (PCIe x1 + USB 2.0) | |||
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Front I/O |
Ethernet | 1 * 10GbE (RJ45) | |
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2 * GbE (RJ45) | ||
| USB | 3 * USB 10Gbps (Type-A) | ||
| 5 * USB 5Gbps (Type-A) | |||
| Display | 1 * HDMI: Resolution up to 4096*2304@30Hz (Type-A) | ||
| LED | 1 * System Status LED | ||
| Button | 1 * Power Button + Power LED | ||
| 1 * System Reset button | |||
| 1 * System Recovery button | |||
| Power Input | 1 * Power Input (2P, P=5.00/5.08, Terminal Block) | ||
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Side I/O |
OTG | 1 * USB 2.0 (Type-C, Flashing port) | |
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Debug | 1 * USB 2.0 (Type-C, Debug port) | |
| TF | 1 * TF Card Slot | ||
| SIM | 1 * Nano SIM Card Slots | ||
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Internal I/O |
Front Panel | 1 * Front Panel (Power + Reset + Recovery, wafer) | |
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Docking | Ethernet (88E1512) + Debug (Uart) + OTG (USB 2.0) + GPIO | |
| FAN | 1 * System Fan (wafer) | ||
| GPIO | 8bit GPIO (OS Configurable DI/DO and H/L, wafer) | ||
| Serial | 2 * RS232/485 (Jumper Switch, wafer) | ||
| 1 * TTL (wafer) | |||
| Audio | 1 * Audio (Line_Out + Mic) (wafer) | ||
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Power Supply |
Type | AT/ATX | |
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Power Input Voltage | 12 ~ 28V DC | |
| Connector | 1 * Power Input Connector (2P, P=5.08mm, Terminal Block) | ||
| RTC Battery | CR2032 Coin Cell | ||
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OS Support |
Linux | Jetpack6.2 (Ubuntu22.04) | |
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Mechanical |
Enclosure Material | Aluminum alloy | |
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Dimensions | 118.2mm(L) * 130mm(W) * 57.6mm(H) | |
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Mounting | Bracket Mounting | |
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Environment |
Heat Dissipation System | Active Fan Cooling | |
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Operating Temperature | -20~50℃ (Industrial SSD) | |
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Storage Temperature | -40~80℃ (Industrial SSD) | |
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Relative Humidity | 10 to 95% RH (non-condensing) | |
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Vibration During Operation | 3Grms@5~500Hz, random, 1hr/axis | |
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Shock During Operation | 15G, half sine, 11ms, ±X/Y/Z, 3 shocks/axis | |
